Manufacturing Details
SMT Assembly
Printed Circuit Assembly (PCA) offers the latest SMT technology & processes, combined with state-of-the-art quality management systems, on a global scale. The company specializes in high volume, high complexity mixed technology by using SMT machines. Our SMT is having capacity to placement like Ball Grid Array(BGA), QFP & connector.
Allo.com offers assembly & both in-circuit & functional testing from the company’s. All facilities feature state-of the-art equipment with 3D solder volume paste, AOI & X-ray inspection capabilities, complemented by a tight process monitoring.
Our assembly services are complemented by front-end product development capabilities including strong design experience. Our first Motto is QUALITY.
PCB Capabilities
- 0603 chip
- CCGA
- COB
- CSPS
- Double sided, Mirrored BGA assembly
- Double sided, single reflow processing
- Fine pitch high pin count press fit connectors
- Flip chip
- Lead free assembly
- uBGA
- Continuous flow SMT lines
- Optical splicing
Capabilities
- 5DX
- AOI
- Burn In
- ICT – in circuit test
- Functional verification test (FVI)
- Diagnostic
- X-ray
Facilities
- Surface mount technology
- Mixed Technology assemblies
- Fine pitch QFP,QFN
- BGA, Micro-BGA,
- Systems and Box Build
- Functional Test
- Device Programming
- Automated Optical Inspection
Infrastructure
| Screen Printers – DEK ELAI & MPM | Auto vision system- cognex 5000. Under stencil cleaner wet/dry. Stencil standard 29x29 frame size. Max Board Size: 20"x 16"(508mm x 406mm). Max Print Area: 18"x 16"(457.2mm x 406.4mm). |
|---|---|
| Paste Inspection Cyber Optics SE300 | 100% 3D Solder Paste Inspection for fine pitch. 3D Height, True Volume and Area Measurements. |
| Fuji CP42 & CP 732 E Chip shooters | PCB Size 50mm sq to 356 x 254mm. 0201, 2010, SO 8 & SO16. Accuracy +/- 0.066mm @ 3 sigma +/- 0.132mm @ 6 sigma. No. Of Components / Hour – 50,000. |
| GSM Precision placer | PCB Size – 16” x 18”. BGA down to 0603 component. Platform Tray Feeder. Speed - 5,000 CPH. Accuracy - +0.1mm. |
| Reflow Oven – Vitronics Soltec XPM 520 and BTU. | Air/N2 Ready. Five heating zones. |
| In-circuit tester. Concorde make Model T 800 FV | Checks IC Missing and orientation. Ten highest component failure display. Auto guarding and Pin number search function. Self diagnostic function & Loop test. A fixed voltage generator offers a fast method of charging the Capacitors and saves time during test. |
| HP 5DX X-Ray Inspection Series II machine | Automatic analysis of joints. High repeatability measurements. Accurate good/bad decisions. Display of cross sectional images. High fault coverage, typically 98% of process defects. |
| Air-VAC BGA Rework Station DRS 26 | Max. Board Size: 250 x 400 mm. VISION: 3 in. x 3 in. max. Comp. size. |
| Data I/O PP100 Programmers | Flexible and Quality programmer/handler with vision. High level of quality and reliability. Up to 600 devices per hour for devices with programming times less than 80 Seconds with any packaged format. |
| AOI-YES Tech | 100% inspection of chip & fine pitch components Inspection capability:- Throughput up to 5sq .in/sec>component per hour Minimum component size-0201; 01005 with high magnification option |
ROHS Compliance
All our products could be designed to comply with these EU directives providing Independent proof of compliance, including component vendor’s conformity self declarations of each component type.
Vendors supplying products to Allo.com also comply with the requirements of above mentioned, and are responsible for ensuring that their component suppliers also provide proof of conformity.
Build Yours Today!
- sales@allo.com
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